| A. Research Interests |
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IC packaging; Solar cells; Copper electroplating |
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| B. Selected Publication |
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Manik Chandra Sil, Li-Syuan Chen, Chin-Wei Lai, Cheng-Chung Chang*, and Chih-Ming Chen*, 2020 September, “Enhancement of Solar Efficiency of Dye-Sensitized Solar Cell by Molecular Engineering of Organic Dye Incorporating N-alkyl Attached 1, 8-Naphthalamide Derivative”, Journal of Materials Chemistry C, Vol. 8, 11407-11416. |
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Tzu-Jung Liu, Manik Chandra Sil, and Chih-Ming Chen*, 2020 June, “Well-organized Organosilane Composites for Adhesion Enhancement of Heterojunctions”, Composites Science and Technology, Vol. 193, 108135.
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Ping‑Heng Wu, Yu-Zhong Lai, Yan-Ping Zhang, Manik Chandra Sil, Po-Heng (Henry) Lee, Tzu-Chien Wei*, and Chih-Ming Chen*, 2020 April, “Organosiloxane Monolayers Terminated with Amine Groups as Adhesives for Si Metallization”, ACS Applied Nano Materials, Vol. 3, pp. 3741-3749.
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Shan-Ting Tsai, Ping-Chen Chiang, Chang Liu, Shien-Ping Feng, and Chih-Ming Chen*, 2019 September, “Suppression of Void Formation at Sn/Cu joint Due to Twin Formation in Cu Electrodeposit”, JOM, Vol. 71, pp. 3012-3022. |
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Tzu-Jung Liu, Chien-Han Chen, Pei-Yu Wu, Ching-Hsuan Lin*, and Chih-Ming Chen*, 2019 June, “Efficient and Adhesiveless Metallization of Flexible Polyimide by Functional Grafting of Carboxylic Acid Groups”, Langmuir, Vol. 35, pp. 7212-7221.
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Hsuan Lee, Yi-An Wang, and Chih-Ming Chen*, 2018 October, “Development of nanotwins in electroplated copper and its effect on shear strength of tin/copper joint”, Journal of Alloys and Compounds, Vol. 765,pp. 335-342. |
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Chih-Hsiang Huang, Yu-Wen Chen, and Chih-Ming Chen*, 2018 March, “Chromatic Titanium Photoanode for Dye-Sensitized Solar Cells under Rear Illumination”, ACS Applied Materials & Interfaces, Vol. 10 (3), pp 2658-2666. |
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Kamani Reddy, Yen-Chiao Chen, Chih-Chung Wu, Chia-Wei, Hsu, Ya-Ching Chang, Chih-Ming Chen*, and Chen-Yu Yeh*, 2018 March, “Co-sensitization of Structurally Simple Porphyrin and Anthracene-based Dye for Dye-Sensitized Solar Cells”, ACS Applied Materials & Interfaces, Vol. 10 (3), pp 2391-2399.
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Hsuan Lee, Tai-Yi Yu, Hsi-Kuei Cheng, Kuo-Chio Liu, Po-Fan Chan, Wei-Ping Dow*, and Chih-Ming Chen*, 2017 July, “Impurity Incorporation in the Cu Electrodeposit and Its Effects on the Microstructural Evolution of the Sn/Cu Solder Joints”, Journal of The Electrochemical Society, Vol. 164, pp. D457-D462. |
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Yu-Jie Lin, Jyun-Wei Chen, Po-Tsung Hsiao, Yung-Liang Tung, Cheng-Chung Chang, and Chih-Ming Chen*, 2017 April, “Efficiency Improvement of Dye-sensitized Solar Cells by In-situ Fluorescence Resonance Energy Transfer”, Journal of Materials Chemistry A, Vol. 5, pp. 9081-9089. |
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Chih-Fan Lin, Nga Yu Hau, Yu-Ting Huang, Ya-Huei Chang, Shien-Ping Feng, Chih-Ming Chen*, 2017 June, “Synergetic effect of Bi2Te3 alloys and electrodeposition of Ni for interfacial reactions at solder/Ni/Bi2Te3 joints”, Journal of Alloys and Compounds, Vol. 708, pp. 220-230. |
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Tai-Yi Yu, Hsuan Lee, Hsuan-Ling Hsu, Wei-Ping Dow, Hsi-Kuei Cheng, Kuo-Chio Liu, and Chih-Ming Chen*, October 2016, “Effects of Cu electroplating formulas on the interfacial microstructures of Sn/Cu joints”, Journal of The Electrochemical Society, Vol. 163, pp. D734-741. |